n i chia st s-da1- 2857a nichia corporation specifications for white led NSSW206DT pb-f r e e r e f l o w so lder ing a ppli c at io n r o hs co mp lia nt http://
n i chia st s-da1- 2857a 1 specifica t ions (1) ab sol u te maxi mum r a ti ngs item symbol absolute maximum rating unit forward current i f 35 ma pulse forward current i fp 100 ma reverse voltage v r 5 v power dissipation p d 112 mw operating temperature t opr -30~85 c storage temperature t stg -40~100 c junction temperature t j 105 c * abs o l u te maxi mum r a t i ngs at t a =25c. * i fp co ndit io n s wi th pu ls e wi dth 1 0 m s an d dut y cycl e 10%. ( 2 ) in it ial e l ect r ical/ o pt i cal c h ar acterist ics ite m symbol condition typ max unit forward voltage v f i f =20ma 2.9 - v reverse current i r v r =5v - - a luminous flux (chro m at ic it y coordinat e 1) v i f =20ma 9.0 - lm lum i no us in te nsit y (chro m at ic it y coordinat e 1) i v i f =20ma 2.9 - cd x - i f =20ma 0.300 - - chroma ticit y c oordinate1 y - i f =20ma 0.295 - - lum i no us f l ux (chro m at ic it y coordinat e 2) v i f =20ma 8.65 - lm lum i no us in te nsit y (chro m at ic it y coordinat e 2) i v i f =20ma 2.8 - cd x - i f =20ma 0.290 - - chroma ticit y c oordinate2 y - i f =20ma 0.275 - - thermal resistance r js - 85 145 c/w * char acteristics at t a =25c . * lum i nous f l ux v a l u e as p e r cie 127: 200 7 s t andard . * chrom a t i ci t y coordi nate s as pe r cie 1931 chrom a ti cit y chart . * r js is th ermal r e si sta n ce from juncti o n to t s measur in g point.
n i chia st s-da1- 2857a 2 ranks item rank min max unit forward voltage - 2. 6 3. 2 v reverse current - - 5 0 a n w 925 9. 25 9.50 n w 900 9. 00 9.25 n w 875 8. 75 9.00 n w 850 8. 50 8.75 n w 825 8. 25 8.50 n w 800 8. 00 8.25 n w 775 7. 75 8.00 n w 750 7. 50 7.75 n w 725 7. 25 7.50 n w 700 7. 00 7.25 luminous flux n w 675 6. 75 7.00 lm color r a nks r a nk bt 04 rank bt05 x 0. 3000 0. 3000 0. 3050 0. 3050 x 0. 2950 0. 2950 0. 3000 0.3000 y 0. 2934 0. 3034 0. 3126 0. 3026 y 0. 2842 0. 2942 0. 3034 0.2934 r a nk bt 06 rank bt07 x 0. 2900 0. 2900 0. 2950 0. 2950 x 0. 2850 0. 2850 0. 2900 0.2900 y 0. 2750 0. 2850 0. 2942 0. 2842 y 0. 2658 0. 2758 0. 2850 0.2750 r a nk bt 08 rank bt09 x 0. 2800 0. 2800 0. 2850 0. 2850 x 0. 2750 0. 2750 0. 2800 0.2800 y 0. 2566 0. 2666 0. 2758 0. 2658 y 0. 2474 0. 2574 0. 2666 0.2566 r a nk bt 10 rank bt11 x 0. 2700 0. 2700 0. 2750 0. 2750 x 0. 2650 0. 2650 0. 2700 0.2700 y 0. 2382 0. 2482 0. 2574 0. 2474 y 0. 2290 0. 2390 0. 2482 0.2382 r a nk bt 12 rank bt24 x 0. 2600 0. 2600 0. 2650 0. 2650 x 0. 3000 0. 3000 0. 3050 0.3050 y 0. 2198 0. 2298 0. 2390 0. 2290 y 0. 2834 0. 2934 0. 3026 0.2926 r a nk bt 25 rank bt26 x 0. 2950 0. 2950 0. 3000 0. 3000 x 0. 2900 0. 2900 0. 2950 0.2950 y 0. 2742 0. 2842 0. 2934 0. 2834 y 0. 2650 0. 2750 0. 2842 0.2742 r a nk bt 27 rank bt28 x 0. 2850 0. 2850 0. 2900 0. 2900 x 0. 2800 0. 2800 0. 2850 0.2850 y 0. 2558 0. 2658 0. 2750 0. 2650 y 0. 2466 0. 2566 0. 2658 0.2558 r a nk bt 29 rank bt30 x 0. 2750 0. 2750 0. 2800 0. 2800 x 0. 2700 0. 2700 0. 2750 0.2750 y 0. 2374 0. 2474 0. 2566 0. 2466 y 0. 2282 0. 2382 0. 2474 0.2374
n i chia st s-da1- 2857a 3 r a nk bt 31 rank bt32 x 0. 2650 0. 2650 0. 2700 0. 2700 x 0. 2600 0. 2600 0. 2650 0.2650 y 0. 2190 0. 2290 0. 2382 0. 2282 y 0. 2098 0. 2198 0. 2290 0.2190 * r a nking at t a =25c. * f o rw ard v o l t age t o le r a nce: 0. 05v * luminous flux t o ler a nc e: 5% * chrom a t i ci t y coordi nate t ol e r a nce : 0 . 003 * led s from the abo v e r a nk s wil l b e shi p p e d. the r a nk combinat ion r a t i o per sh ipmen t will be d e cided by nichia .
n i chia st s-da1- 2857a 4 chroma ticity d i agram bt04 bt 0 5 bt 0 6 bt 0 7 bt 0 8 bt 0 9 bt 1 0 bt11 bt12 bt 2 4 bt 2 5 bt26 bt27 bt 2 8 bt 2 9 bt 3 0 bt 3 1 bt32 0. 15 0. 20 0. 25 0. 30 0. 35 0. 20 0. 25 0. 3 0 0 . 35 0. 40 x y
n i chia st s-da1- 2857a 5 outline dimensions sts- da7- 1271a n x sw206x no. ( g un it: mm) t h is p r o d uc t co m p li es wi th ro hs d i re cti v e. u ? ro hs ? m ?? * ( g un it : mm, to le r a n c e : 0 . 1 ) dim e ns io ns d o not inc l ude m o ld flas h o r me tal b u rr. ? * ka ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?`? ? + w? silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0.0041g(typ) 3.5 3.8 (3.6) 0.6 (0.46) (2 . 8 ) cathode mark cathode 0.4 anode 0.68 (0.63) 0.66 (0.07) 0.27 1 0.43 0.45
n i chia st s-da1- 2857a 6 soldering ? r e co mm end e d r e f l ow sold ering co ndi t io n ( lead -free sol d er) ? r e co mm end e d hand so lde r ing co nd it io n temperature 350c max soldering time 3sec max ? r e co mmend e d sold ering p a d p a ttern ( g unit: mm) 1.5 2.1 1.5 0.85 (0.19) * thi s led is desi gned to be refl ow so l dered on to a pc b . if di p s olde r e d , n i c h i a c a nnot guar ant e e it s r e li abili t y . * r e fl ow so l d eri n g must not be perform ed more than twice. hand sol d ering mu st not b e performed more than o n ce. * a v oid r a pid cooling. r a mp down th e temp er ature gr adua lly from th e pe ak tem p er at ure. * n i t rogen ref l ow soldering is reco mmend e d. ai r fl ow sold ering cond it ion s can caus e op ti cal d e gr adat i o n, caused by h e at and / or atmospher e . * r e pairing should not be d o ne after th e l e ds ha v e been solder ed. wh en repair ing is u n a v oidable, a do uble-h e a d so lder ing ir o n sho u ld be u s ed. it shoul d b e confi r med b e forehand wh et h e r th e char ac te rist i cs of th e l ed s wi ll or w i ll not be da maged by repairing . * when sold ering, do not ap ply str e s s to t h e le d whi l e th e le d is ho t . * w hen us ing a pick and p l a c e m a ch in e, ch oose an appro p riate nozzle f o r this product. * the reco mmen ded so lder ing pad pa tter n is d e sign ed fo r attac h m e n t o f the le d w i t h o u t pro b le ms . w h en preci s e mou n t i ng a c cur a cy i s requ i r ed, s u ch a s h i gh-de n s i t y mo unt ing , en sur e tha t th e s i ze a n d shap e of th e pad are sui t ab l e for the ci rcuit desi gn. * consid er fa ctors such as the refl ow sold e r ing t e m p er atu r e, ha nd sold er ing t e mper at ure, e t c . wh en c h oosi n g th e so l d er . * when fl ux is used, i t should be a ha l o g e n free fl ux . ensure tha t th e m a nufac tur i ng pr oces s is not d e sign ed in a ma nner where the f l ux wil l co me in conta c t w i t h t he le ds . * make sure t h at t h er e are n o issues with the t y pe and a m oun t o f so ld e r that is b e i n g used . 120sec max pre- hea t 180 t o 200c 260cmax 10sec max 60sec max above 220c 1 t o 5c pe r se c
n i chia st s-da1- 2857a 7 t a pe and reel dimensions n x xx206x sts- da7- 0148a r e e l siz e : 5000pc s 1 ` ? 5000 * the t a pe packing me t h od compl i e s wi t h j i s c 0806 ( p a c k a g i n g of e l e c t r on i c c o mp on e n t s o n co n t i n u o u s ta p e s) . * j i s c 0 806 ? ` ? ?`? tape 1.7 5 0. 1 2 0 .0 5 4 0.1 5. 5 0 . 0 5 4 0. 1 12 +0. 3 -0 . 1 -0 1.5 +0 . 1 ( g un i t : mm) ? no. 0.2 0.05 3.95 0.1 0.75 0.1 1.15 0.1 `? reel 15. 4 1 60 +1 -0 -0 180 +0 -3 2 1 0 . 8 1 3 0 . 2 ? label 13 +1 0.5 0.1 cathode mark ? ` / ` trailer and leader ?? ` ?` e m bossed carri er tape ? ??` to p co ver ta p e f eed di re ct ion ` 400mm l eader witho u t to p co v er ta pe 4 0 0 m m mi n ? ` 160mm trail e r 1 60m m min( emp t y po c k e t s) led ? lo aded po ck ets 100 m m l e ader w i th t o p co ver t a pe 100 m m min( empt y pocke t ) * g? I ? ?? ??` ? `? ? ? ??`? (1 0 n ) ? led ` ` ? N ? ? w h en the ta pe is rewo und due to wo rk interru pti o ns , no mo re than 10n sho u ld be appl ied to the em bos s e d ca rri e r tape. t h e leds may stick to the top cover tape.
n i chia st s-da1- 2857a 8 p a ckaging - t a pe & reel nichia led sts-da7-0006c n x xxxxxx ? label la b e l no . reel ` ?` sea l moistu re-proo f ba g ? ? rohs nxxx xx xx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan typ e lot qty. ym xx xx -rrr pcs rohs nxx xxx xx xxxx led ** *** ** rr r pcs typ e ra nk qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-sealed moisture-proof bags. ` ? ` de sic c an t s m o is tu re -pr o o f ba gs a r e pa ck e d in c a r d bo a r d bo x e s w i th c o r r u ga ted pa rti t i o n s . ? K ? ` ? ?` ? ? ? y ? ? * ? \ H? y ? B ? ? y * ? Q H n ? u? p ? ? ? ? * us ing t h e o r igi n al package mat e r i al o r e q uivale nt in t r ans i t is r e c o mme nd e d . do no t ex po s e to water. t h e bo x i s no t water-res i s t ant. do no t dro p or expos e t h e bo x to external fo rces a s it m a y dam a ge the produc ts. p r o d uc ts s h i p pe d o n tape a n d reel a r e pa ck ed in a m o i s tu re-proo f bag. t hey a r e shi p ped i n c a rdbo ard bo x e s to pro t e c t them fro m ex te rnal f o rce s during trans p o r ta tio n. * u ? ?` ? n ? g o ?` y ? if not provide d , it w ill n o t be ind i cat e d on t h e l a b e l . * ****** is t h e c u st ome r part numbe r . O * ******* ? for d e t a i l s, se e "l ot num b er i n g code " in t h is d o c u me nt. * ?? ? ? ??? t h e l a bel does no t have the rank f i el d fo r un-ranke d produc ts. * ? ? ?
n i chia st s-da1- 2857a 9 l o t numbering c o de lot numb er is presented by using t h e foll owing al phanum e r i c c o de . ymxxxx - r r r y - y e a r year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - m o n t h mont h m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx - n i c hi a's product n u mber rrr -r ank i ng by color c oordi nat e s , r a nking by lu m i nous flux
n i chia st s-da1- 2857a 10 dera ting characteristics n s s w 206 d ? no. sts-da7-4824 der a t i n g 1 0 10 20 30 40 50 0 2 04 06 08 0 1 0 0 1 2 0 (27, 35.0) (85, 8.50) de ra t i n g 2 0 10 20 30 40 50 0 2 04 06 0 8 0 1 0 0 1 2 0 (54 , 35.0) (90 , 8.50) duty 10 10 0 100 0 1 1 0 100 35 S allowable forward current ( ma ) `??????-S solder temperature(c athode side) vs allowable forward current ? ?- S a m b i en t t e m p e r a t u r e v s a l l o w a ble f o r w a r d c u r r e n t S al l o w a b l e f o r w a r d c u r r e n t ( m a ) S a l l o w a bl e f o r w a r d c u r r e n t ( m a ) ` s o l d er t em p er a t u r e( cath o d e s i d e) ( c ) ?? a m b i en t t e m p er a tu r e ( c ) ? ` ` du t y r a ti o ( % ) ` ` - S d u ty r a ti o v s a llo w a ble f o r w a r d c u r r e n t 3 75c/w ? ja r = t a =2 5 c
n i chia st s-da1- 2857a 11 optical characteristics n s s w 206 d ? no. sts-da7-4782 sp ec tr um 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 35 0 40 0 450 5 00 550 60 0 65 0 7 00 750 r e l a t i v e i l l um i n a nc e ( a . u. ) direct i v it y 1 90 80 70 60 50 40 30 20 10 0 -1 0 -2 0 -3 0 -4 0 -5 0 -6 0 -7 0 -8 0 -9 0 k spe c t r um k? r e la t i v e e m is s i o n i n t e n s i t y ( a . u . ) L wave l e n g th ( n m ) ? d ir e c t iv it y ? ra d i a t i o n a n g l e 10 . 5 0 0 . 5 1 20ma i f = t a =25 c 20 m a i fp = t a =2 5 c * ?? all characteristics shown are for reference only and are not guaranteed. y y xx x-x y-y
n i chia st s-da1- 2857a 12 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics n s s w 206 d ? no. sts-da7-4783 tavf 2. 0 2. 5 3. 0 3. 5 4. 0 4. 5 - 60 - 4 0 - 20 0 2 0 4 0 60 80 100 1 2 0 ta i v 0. 6 0. 8 1. 0 1. 2 1. 4 - 60 - 4 0 - 2 0 0 2 0 40 6 0 80 100 12 0 vf i f 1 10 100 2. 0 2 . 5 3 . 0 3. 5 4. 0 4 . 5 20 r e l a t i v e l u m i no u s f l u x (a .u . ) ? - am b i e n t te m p e r a t u r e v s r e l a t i v e l u m i no us f l u x f o r w a r d cu rre n t ( m a ) ifiv 0 1 2 3 4 5 6 0 2 04 06 0 8 0 1 0 0 1 2 0 r e l a ti v e l u m i n o u s fl u x ( a . u . ) - fo r w a r d c u r r e n t v s r e l a t i v e l u m i no us f l u x f o r w a r d c u rre n t ( m a ) R- fo r w a r d v o l t a g e v s fo r w a r d c u r r e n t ? - R a m b i en t t e m p e r a t u r e v s fo r w a r d v o l t a g e R for w a r d v o l t a g e ( v ) ?R f o rward voltage(v) ?? amb i en t t em p e r atu r e( c) ?? am b i e n t t e m p erature ( c ) t a =2 5 c * ?? a l l c h ar ac t e r i s t i c s s h o w n a r e f o r r e f e r e n c e o n l y a n d a r e n o t g u ar a n t eed . t a =25 c i fp = 20ma i fp = 20m a i fp = 60ma i fp = 5m a
n i chia st s-da1- 2857a 13 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics n s s w 206 d ? no. sts-da7-4784 ta x y 0.28 0. 29 0. 30 0. 31 0. 32 0 . 2 8 0 . 2 9 0. 30 0. 31 0. 32 -30 c 0c 25 c 85 c x if x y 0.28 0. 29 0. 30 0. 31 0. 32 0 . 28 0. 29 0. 30 0. 3 1 0. 32 1ma 5ma 20m a 35ma 100m a x y y 20 m a i fp = ??-? ambient temperature vs chromaticity coordinate - ? fo r w a r d c u r r e n t vs ch r o m a ti c i ty c o o r d i n a te t a =2 5 c * ? a l l c h a r ac t e r i st i c s sh ow n a r e f o r r e f e re n c e on l y a n d a r e n o t g u ar an t e ed .
n i chia st s-da1- 2857a 14 reliability (1) t e s t s a n d r e sults te s t reference standard test conditions te s t duration failure criteria # units failed/tested r e si st anc e t o soldering heat (reflow soldering) j e it a ed- 4701 300 30 1 t sl d =260c, 10 s e c, 2re f l o w s , pre c ondit i o n : 3 0 c, 70%r h , 168hr #1 0/50 sol derability (r eflow soldering) je it a ed- 4701 303 30 3a t sl d =2455c, 5s e c , le ad- f r e e sold e r ( s n- 3. 0ag - 0.5cu) #2 0/50 ther mal s hock jeit a ed- 4701 300 30 7 0c t o 100c, 15s e c dwell 20c y c l e s #1 0/ 50 t e mperature cycle jeit a ed- 4701 100 10 5 - 40c( 30mi n )~25c( 5mi n )~ 100c( 30m i n )~25c( 5mi n ) 100c y c l e s #1 0/ 50 mois tur e resistance (cycl i c) jeit a ed- 4701 200 20 3 25c~65c~-10c, 90%r h , 24hr per cy cle 10c y c l e s #1 0/50 high t e mp erature stor age j eita ed- 4701 200 20 1 t a =100c 1000hours #1 0/ 50 t e mper ature humidity stor age j eita ed- 4701 100 10 3 t a =60c, r h = 90% 1000hours #1 0/ 50 low t e mp erature stor age j eita ed- 4701 200 20 2 t a =- 40c 1000hours #1 0/ 50 r oom t e mperature oper at ing li fe condition 1 t a =25c, i f =20m a t e st board : se e no tes b e low 1000hours #1 0/ 50 r oom t e mperature oper at ing li fe condition 2 t a =25c, i f =35m a t e st board : se e no tes b e low 500hours #1 0/ 50 high t e mp erature oper at ing li f e t a =85c, i f =8.5ma t e st board : se e no tes b e low 1000hours #1 0/ 50 t e mper ature humidity oper at ing li f e 60c, r h =90 % , i f =15m a t e st board : se e no tes b e low 500hours #1 0/ 50 low t e mp erature oper at ing li f e t a =- 30c, i f = 20m a t e st board : se e no tes b e low 1000hours #1 0/ 50 vibr ation j e it a ed- 4701 400 40 3 200m / s 2 , 100 ~2000~100hz , 4 c ycle s, 4 m i n , each x, y , z 48m i n ut es #1 0/50 board ben d in g j e it a ed - 4702b 003 1bend to a def l ection of 3mm for 51sec #1 0/50 so lder ing jo in t shear streng th j e it a ed-4702b 002 3 5n , 101s ec #1 0/ 50 no tes: 1) t e st board: fr4 board thic kne s s = 1.6m m, c o ppe r la y e r t h ic kne ss=35m , r ja 375c/ w 2 ) m e a s u r e m e n t s a r e p e rformed af ter al l o w i ng the led s to return to room temper a t ure. ( 2 ) f a ilu re c r it eria criteria # ite m s conditions failure criteria f o rw ard v o ltag e(v f ) i f =20ma >u.s.l.1.1 lum i no us f l ux ( v ) i f =20ma u .s.l .2 . 0 #2 so lder abi lity - less than 95% solder coverage u . s.l . : up pe r specif ica t io n lim i t l.s.l. : lo wer spe cif ica t io n li mi t
n i chia st s-da1- 2857a 15 ca u t ion s (1) stor age conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date stor age after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product c o m p li es wit h j e d e c msl 3 or e q uiv a le nt . see ipc/j e d e c std - 020 for m o i s t u re- s e n s i t i v i t y det a il s. absorbed moi s ture i n led packages can v apori ze and expand during sol d ering, w h ich can ca use i n terface del a mi na ti on and result in optical p e rforman ce degr ad ation . prod ucts are pack ed in m o is ture - p roof al um inum bags to min i m i ze mo i s tur e abso rptio n d u ri ng t r anspo r ta tio n a n d sto r age . inc l ude d s ilic a ge l de si cc ant s change from bl ue t o re d i f m o is ture had pe net r at e d bags. after opening the moisture-proof alu m inu m bag, the pro d ucts should g o through th e solder ing pro c ess withi n th e r a nge of th e co ndi t ion s s t at ed above. un us e d rema in ing le ds shou ld be s t ored wi th si li c a gel de si cca nt s in a herm et ically sea l e d co nta i ner , preferab l y the ori g i n al mo i s ture-pr oof bags for stor age. after t h e ?p eriod aft e r op eni n g? s t or age ti me h a s be en exceed ed or s i l i ca ge l de si cca nts ar e no lo ng er blu e , the products shou ld be b a k e d. baking shoul d onl y be d o ne once. customer i s advi sed to k e ep the l e ds in a n ai rti g ht co nt ai ner w h en not i n use. exposure to a corrosi v e en v i ronment may cause t h e pla t ed me ta l part s o f the p r o d uct to tarn i s h, w h i c h co ul d adverse l y affect sold eri n g a n d opti ca l character i s t i cs . it i s also recommended to return th e le ds to th e o r ig i nal mo i s tur e p r o o f bags and resea l . after assembl y and dur i ng use, si l v er p l at i n g can b e affe cted by t h e corrosive ga ses e m i t t e d by com p onen ts an d m a ter i al s in clo s e prox im i t y o f the l e d s wi th in an end pro d u c t , a nd th e gas e s e nter i ng in to th e pro d uc t fro m the ex ter nal a t mo spher e . the above sho u ld b e take n into co ns ider a t io n w h e n des i gning . r e sin mat e r i al s, in part i c u l ar , may co nta i n sub s ta nc e s whi c h ca n affe ct s i lver pla t i n g, su ch a s halo gen. do not use s u lfur- c on tainin g ma terials in c o mm erc i al product s . som e m a ter i al s, su ch a s s e al s and adh e sives , may co nta i n su lfur . the extre m ely corroded or conta m inat ed plat ing of le d s mi g h t cause a n open ci rcuit. si li co ne rubb er i s recommend e d as a mater i al for sea l s. bear i n mi nd , the use of si li co ne s may l e ad to si li cone con t a m i n at ion of e l e c tri c a l con t ac ts inside th e p r o d uct s , caus e d by lo w mol e c u lar we igh t vo l a ti le si lox a ne . t o prevent water cond en s a tion , p l eas e avoid large te m p er at ure a n d h u midit y fluctua t ion s for the stor age conditi o ns. do not stor e th e le ds in a dus t y en viro n m en t . d o not expo se the leds to di rect s u n lig ht and/or an e n vi ronme n t w h er e th e te mp er at ure i s hi gher t h an normal room temp er atur e. (2) di recti o ns for use when desig n i n g a ci r c ui t, the curre n t thro ugh ea ch le d mu st no t exc e ed th e abso lu t e maxi mu m r a tin g . oper ati n g a t a co nstant current p e r led is reco mmen ded. in case of o p er ating at a c o nsta nt vo ltag e, c i rcu i t b is r ecom m ende d . if the led s are oper ated w i th con s ta nt vo ltag e us ing c i r c ui t a, th e curr ent thro ug h t h e le ds may v a ry due to t he v a riat io n in f o r w ar d v o ltage ch ar acteristics of t h e leds. (a) ... (b) .. . this product sho u l d b e oper ated using forw ard curre n t . ens ure t hat th e pro d uc t i s no t subj ec ted to ei ther forw a r d or rev e rse v o l t ag e whi l e it i s no t in use. i n particul ar , subjecti ng i t to continuous rev e rse v o l t age may cause migr a t ion , wh i c h may cau s e damage to t h e led d i e . when used i n d i sp la ys tha t are no t used for a l o ng time, the ma i n po wer supp l y sho u l d be switched off for safet y . it is recom m en ded to ope r ate the le ds at a current gr eater t h an 10% of the sorting current to stabilize the le d char acter i stic s. care must b e tak e n to ensure th at t h e re verse vol t age wil l no t exce ed the ab sol u t e maxi mu m r a t i ng when us ing the l e d s wi th matr ix drive . e n su re th at e x c e ss i v e v o l t age s su ch as li g htn ing surge s are no t app l i e d to th e le ds . f o r outdoor use, necessary mea s ures sho u l d be tak e n to prevent wa ter , mo i s tur e and sal t air da mag e .
n i chia st s-da1- 2857a 16 (3) handl i n g precau ti ons do not hand le t h e l ed s wit h bare hand s a s it w i ll conta m ina t e t h e l e d s u rface and may affect th e op ti cal char ac ter i st ic s: i t mi g h t cause the led to be deformed a n d/or the w i re to break, w h ic h will c a us e t h e le d not to illum i na te . the lead co uld a l so ca us e an inj u ry . when ha ndling t h e produ c t with t w ee z e r s , be ca reful not to appl y ex cess ive forc e to the r e s i n. otherwis e, the re si n can be cu t, ch ipped, delamina te or deform ed , causing w i re-bo n d breaks an d cata stroph ic fa ilures. dropping th e product ma y cause damage. do no t sta c k asse mb led p c bs to g e t h er . f a il ure to co mp l y can cau s e th e res i n po rt io n o f the pro d u c t to be c u t , ch ip ped, delaminated and/or defor m ed . it ma y cause w i re to break, lead i n g to catastrophi c f a i l ures. (4) desi gn consi d er ati o n pcb warpag e after mo un ti ng th e pro d uc t s o n to a pc b c a n cau s e the p a ck age to br ea k . the led s h ould be p l ac ed in a way to m i ni mize t h e s t re ss on the l ed s due to pc b bo w and tw is t. the positio n and orienta t io n of the leds affect how m u ch me cha n i c al stre ss i s exerte d on the leds pl aced near the score li nes. the led s h ould be p l ac ed in a way to m i ni mize t h e s t re ss on the l ed s due to board f l ex ing. board separ a ti on must b e performed us in g spec ia l j i g s , no t u s in g hand s. (5) el ectrostati c di scha r ge (es d ) the produ c t s are se ns it ive to sta t ic e l e c tr i c i t y or surg e voltag e. es d ca n damag e a di e and i t s re l i ab il i t y . when handling t h e produ c ts , th e followin g mea s ure s ag ains t e l e c tro s t a ti c di sch arge are stron g ly re com m e n ded : e l i m i n a t i n g t h e c h a r g e grounded wri s t st r ap , esd foot w e ar , clot hes, a n d fl oo rs grounded workstat ion equipm en t and tools esd tabl e/s h e l f ma t ma de of condu c t i ve ma ter i al s ens u r e t h at to o l s (e .g. so ld ering iro n s ) , j i gs and ma ch in es t h at ar e be i n g us ed are pr operly ground e d and that proper grounding tech niqu es ar e used in wo rk area s. f o r dev i c e s / equi pm en t tha t mo u nt th e le ds , protectio n a g ain s t s u rge voltag es s h ou ld also be us ed. if tools or e q uip m e n t co nt ain i n s u la ti ng mat e ria l s su ch as gla ss or pla s t i c , t h e fol l o wi ng m e as u r es agai n st el ec t r os t a ti c di sch arge are stron g ly re com m e n ded : diss ipat i n g sta t ic c h arg e wi th co nduc t i ve mat e ria l s preventi ng charg e gen e r a tio n w i th m o is ture n e u t r a l i z i n g t h e c h a r g e w i t h i o n i z e r s th e cu st ome r i s advi se d to c h ec k if the leds are da ma ged by esd when performing the char acter i stics i n sp ecti on of t h e led s i n the app l icati o n. d amage ca n be detected wi th a forw ard v o l t ag e mea s urement or a li g h t - up test a t l o w current ( 1m a ) . esd damag e d led s may h a ve an incr e a s e d leak ag e cur r ent , cur r e nt f l o w at a lo w vo ltage o r no lo nge r ill um ina t e at a lo w cur r e n t . f a ilur e c r iter ia : v f <2.0 v at i f =0.5ma
n i chia st s-da1- 2857a 17 (6) t h ermal manageme nt proper th er mal manag e m e nt is a n i m po r t an t when designing prod ucts with le ds . le d di e t e mp er at ure i s affec t ed by pcb ther mal r e sistan ce and le d spa c ing on th e boar d. pl eas e de sig n produc ts in a way that t he l e d d i e t e mperature does not exceed th e max i mu m j unc t i on t e mper a t ure ( t j ). d r i v e current should be d e ter m i n ed for t h e s u rround ing ambi en t te mp er ature (t a ) to dis s ipa t e the h e at fro m the pr o d uct . the fol l owi n g equat i on s ca n be us ed to c a lcu l a t e the ju nct i on te mper a t ure of t h e pro d uct s . 1 ) t j =t a +r ja ? w 2 ) t j =t s +r js ? w * t j =led junc tio n te mp e r ature: c t a = a m b i e nt te mp e r a t ure : c t s =soldering te mper a t ure ( c at hode s i de) : c r ja =th e rma l resi stance from ju nc tio n to amb i e n t : c/w r js =therma l resi stance from juncti o n to t s measuring point: c /w w = i n p u t p o w e r ( i f v f ): w ts p oint (7) cl eani ng the leds shoul d no t be cl eaned w i th w a ter , benz i n e, a n d / or thi n ner . if r e quir ed, iso p r o py l a l co h o l (ip a ) s h o u l d be use d . o t he r solven ts may caus e pre m at ure fai l ure to t h e le ds due to the d a mage to th e r e si n port ion . t h e effe ct s of s u ch solve n t s s h ould b e v e ri f i ed pri o r to use. in additio n , the use of c f c s su ch as freo n is heavi l y re gula ted . when du st and/or dir t adh e res to th e le ds , so ak a c l o t h wit h is o p r o p y l alco hol (ip a ), t h e n squ e eze i t b e fore wiping the led s . ultr ason ic cleaning is no t recom m e nde d s i nc e i t may have adverse eff e ct s on t he l e ds depending on the ultr ason ic power a n d h o w led is assembled. if ultr asonic clea ning m u s t be use d , t h e c u sto m er is adv i se d to mak e sure the led s w i ll not b e da ma ged pri o r to cl eani ng . (8) ey e saf e t y in 2006, t h e inte rnat i o nal el ec t r i c al comm is si on (iec ) publi s he d iec 62471: 200 6 phot obi o l ogic a l s a fet y of l a m p s and lamp sy ste m s, wh ic h a dded le ds in it s scop e . on t h e ot her hand, t h e iec 60825- 1: 20 07 l a s e r s a f e t y s t andard r e mo v e d leds from it s sc ope. however , pl ease b e advi se d that som e co untr i es and regions ha v e ado p ted stand a rds bas e d on t h e iec l a s e r safe t y s t andard iec 60825- 1: 20 112001, whi c h s t ill i n cl udes leds i n i t s sc op e . most of n i chi a 's l e ds ca n be cl a s si fied as bel o ng ing in to either the ex empt group or risk group 1. hi gh- p owe r leds , t h at emit li gh t con t aining blu e w a vele ngth s, ma y be cla s s i fi ed as ri sk group 2 . please pro c eed wi th cau t io n whe n view in g direc t ly an y leds dri v en at hi gh current, o r vi ewing led s with opt i ca l ins t ru me nt s w h ic h may gr eat l y in crea se t h e damage s to your eyes . view ing a f l ashi ng l i gh t m a y caus e eye d i s c omfort . when in corpor ating the l e d i n to y o ur product, pl ease be careful to a v oi d adv e rse eff e cts on the hu man body caused by ligh t stimu l a t ion.
n i chia st s-da1- 2857a 18 (9) ot hers the le d s d e scr ibed in th is brochure ar e i n te nded to be used for ordina ry el ectroni c equi p m en t (such as offi ce eq uipment, commun i cat i ons equ i pm en t, mea s ure m e n t in str um e n t s and hou s eho l d applia nc es ). co nsult n i c h ia' s sal e s staf f in adv a n c e f o r inf o r m a t io n o n th e appl ica t i o ns i n wh ich e x ceptio na l qua l it y and r eliab i l i t y ar e r eq u ir ed , par t icu l ar ly when the f a il ure o r malf u n c t io n o f the le ds m a y direc t ly j eo p ardize lif e o r heal th (such as for ai rplanes, a e rospa c e, sub m ersi b l e repeaters, nucl e ar reactor co nt r o l sy s t e m , a u t o mobi le s, tr affi c contr o l equi p m ent, li fe su pport s y stem s an d s a fet y de vi ce s). the c u s t om er sha ll not reverse eng i ne er by disas s e m bl i n g or analys is of the le d s wit h out ha v i ng pr ior writt e n co ns ent from nich i a . w h en def e c t ive le ds are fou n d, t h e c u s t om er sh a ll inf o r m ni ch ia dir ec t ly bef o r e di sas s e m bl ing o r ana l y s is . the sp ecification s and app e ar ance of th i s pro d uct may c h ange w i t h o u t no ti ce ; nich i a do e s no t guar an te e the co nt en ts o f thi s sp ec ifi c at i o n. bo th t h e c u sto m er a n d n i ch ia will agr e e o n th e o f f i c i al s p ec if ic at io ns o f supplie d pr o d uct s bef o r e th e vo lum e pr o d u c t i o n o f a pr o g r a m begins .
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